Of course, the size increases with each attached module. However, snapping on the power bank module makes the thickness comparable to a standard modern smartphone. Another key feature here is how these various modular components stick together. Tecno has developed new interconnection technology that uses both magnets and pin connectors. This should make it easy to both attach and remove components.
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The key is the test TST_SEL_RET on line 682. It compares the RPL of the return CS selector (saved on the stack by the original CALL) against the current CPL. If RPL == CPL, the PLA returns 0x000 (continue) and LD_DESCRIPTOR finishes normally -- same-privilege return. If RPL CPL, the caller is returning to a less-privileged ring, so the PLA redirects to 0x686 (RETF_OUTER_LEV) -- the cross-privilege path that must also restore the caller's stack. If RPL，详情可参考im钱包官方下载